EPIC Event “Automation Tools for Packaging and Testing”
From May 22 to 23, 2018 PI (Physik Instrumente) was host to the EPIC networking meeting on “Automation Tools for Optoelectronics Manufacturing, Packaging and Testing”. We were happy to receive Photonics industry leaders at the PI Technology Center in Karlsruhe, Germany. In addition to presentations the main emphasis of the meeting was on the conversation and share of opinions among attendees which was continued during dinner. A company tour rounded up the meeting and also allowed a glimpse of production capabilities at PI.
Topics: Manufacturing & Test: New devices, new challenges
Testing challenges
- Wafer scale test and instrumentation for SiP, LIDAR and optical elements… and quantum
- Post-singulation test and qualification
- Integrated solutions
- OEM Automation components: advancements in precision, throughput, yield
- Handling and environmental management
Packaging challenges
- The latest in machine vision
- Fixturing, conveying, handling, robotics
- Bonding technologies
- Design for packaging
- High volume imaging optic manufacturing
Standards: Helpful When?
- Device formats
- Materials & fabrication
- Design for test
